Resin bond saw blade for hard alloy cutting is mainly used to cut and make groove in metal and nonmetal materials which are hard to cut and groove, such as:
Semiconductor materials: Si, Ge, GaP, GaAs, GaAsP, BiSb, BGA, QFN,SiC,FQFN, solar battery and so on.
Ceramic materials: Al2O3,ZrO2, Si3N4,BaTiO3,CaTiO3 and so on.
Magnetic materials: magnetic core, magnetic sheet and so on.
Metal materials: high speed steel, tool steel, die steel, bearing steel and so on.
Other materials: glass, cystal, electronic components and so on.
Product Variety | Size(mm) | ||
Diameter | Inner hole | Thickness | |
Metal/Resin bond On steel | 60-85 | 9-40 | 0.3-0.5 |
0.6-2.0 | |||
90-115 | 9-70 | 0.3-0.5 | |
9-80 | 0.6-2.0 | ||
120-160 | 9-70 | 0.4-0.55 | |
9-80 | 0.6-2.0 | ||
170-180 | 20-70 | 0.5-0.75 | |
20-80 | 0.8-2.0 | ||
185-195 | 20-70 | 0.5-0.9 | |
20-90 | 1.0-2.0 | ||
200 | 20-100 | 0.6-0.9 | |
1.0-2.0 | |||
Remarks: 1,We can supply two grades of this saw blade, high-precision and normal-precision. The thickness deviation for high-precision is less than 0.0.04mm.The thickness deviation for normal-precision is between 0.03mm and 0.08mm. 2,Any size according to your request. |
Our products: Synthetic diamond cystal ,diamond powder,diamond paste,electorplated diamond plate and wheel,diamond saw,PCD,diamond dermbabrasion,ceramic bond tools,metal band tools ,resin bond tools,marble cutting blade and TCT saw blade.
Our R&D team: Eight engineers are persist in improving our quality and reducing the cost of our diamond tools.
OEM:Your design also can be finished.
Constant quality: All productions are accord with the quality control system of ISO 9001.
Best price: Raw materials from ourselves, effective management and cheaper labor ensure us to reduce our cost of diamond tools.
Fast lead time: In 10days after your confirmation.
After sales: Technical consultation at any time and all products are guaranteed for one year.
Resin bond saw blade for hard alloy cutting