Min Thickness (Inner Layer Residue Copper 0.5oz, Resdiue Copper Rate 65%)

4L

6L

8L

10L

12L

14L

16 mils

24 mils

32 mils

40 mils

48 mils

56 mils

Min/Max Layer Count

Min 2 Layer, Max 22 Layer

Min Inner Layer Thickness

4 mils

Min Trace / Space

4/4 mils Protype 3/3 mils Copper (Thickness 1/ 3oz)

Min Finished Hole Size

8 mils (Aspect Ratio 5)

Drilling Accuracy

±3 mil

Lamination Evenness

±3 mil

Min Channel of SMD Pitch

10 mil

Min Channel of SMD Pitch

8 mil

Min DAM Between Fine Pitch

4 mil

Min Space of Soldermask

4 mil

Layer To Layer Registration Tollence

±3 mil

±3 mil

±3 mil

±3 mil

±3 mil

±3 mil

Impedance Control Tollance

100

100 ±10%, 50 ±10%

Board Bow / Twist Tolerance

< 0.75%

Min Length (V-Cut)

2 inch

Max Width (V-Cut)

29 inch

Min Width (V-Cut)

2 inch

Min Board Thickness (V-Cut)

12 mils

Golden Finger Max Width Beveling

70 mils

Max Working Size

29 x 22.44 inch