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| SERIAL | ITEM | TECHNICAL DATA |
| 1 | Layers | 1-16 Layers |
| 2 | Base-materal | FR-2, CEM-1, FR-4, Metal base, Rogers... |
| 3 | Board thickness | 8~126 mil (0.2~6.0mm) |
| 4 | Copper foil | 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz (18-175um) |
| 5 | working panel size | 12" x 13" ~ 21" x 24" |
| 6 | Min. drill size(finished) | 8mil (0.2mm) |
| 7 | Hole diameter tolerance | PTH: ±3 mil, NPTH: ±2mil |
| 8 | Hole location tolerance | ±2mil |
| 9 | PTH wall thickness | ≥20um |
| 10 | Aspect ratio | 10/1 |
| 11 | Line width/space | 4/4mil |
| 12 | Line width/space tolerance | ±20% |
| 13 | Via plug | Max via size: 24mil (0.6mm) |
| 14 | S/M pitch | Min.: 2mil (0.05mm) |
| 15 | HASL(HAL) | 40u"~1000u" |
| 16 | OSP(Entek) | 2-5um |
| 17 | Gold finger | Ni: 80~250u", Au: 1~5u" |
| 18 | Immersion gold(ENIG) | Ni: 80~200u", Au: 1~8u" |
| 19 | Warp and twist | ≤0.75% |
| 20 | Outline Tolerance | ±6mil (0.15mm) |
| 21 | Impedance tolerance | ±10% |
| 22 | Insulation resistance | 1E + 12Ω(Normal) |
| 23 | Solder mask abrasion | ≥6H |
| 24 | Electric strength | >1.3KV/mm |
| 25 | Peel Strength | 1.4N/mm |
| 26 | Thermal Shock | 3 x 10Sec@288ºC |
CREE LED PCB with cup hole