Parts for power semiconductor devices Got ISO 9001 ISO 14001 OHSAS 18001 OEM service Export to USA,Germany,and so on.

Main material:Ceramic parts: ≥93.5% Al2O3Glaze: color white or pink, T≥1,450°Flange: TU1 (OFHC Cu) or Ni42Fe58 alloyCopper contact: TU1 (OFHC Cu)Solder: Ag72Cu28 alloyGate tube: TU1 (OFHC Cu) or Ni42Fe58 alloyTechnical specificationsThe all products can reach to the below standards Leak rate: ≤1 x 10-8 bar cm3/sec with heliumFlatness of copper surface: ≤0.008mmParallelism between copper surfaces: ≤0.03mmConcentricity between flange and copper: ≤0.5mmPull test: ≥5kN/cm2Temperature cycling: -65° - 200°, 5 circlesNickel plating thickness: 2-7μm

Ceramic Packages for semiconductor