solder VIP2,Sn99Ag0.3Cu0.7. Alloy: Sn99Ag0.3Cu0.7Size: μm : 25~45Application: fine space 400μm, super fine space with NO.5melting point: 217~219metal content% : 89.5~90.2conglutination: 700~1000Pa.slife: 12 monthsmodule life: >24 hoursprinting speed: most 150mm/s

adhere time: >24 hours

solder paste for soldering SMD components- VIP2