BGA/IC/CPU reballing Station (SV560) Auto soldering and desoldering PLC control,optical vision system Can work on 2*2mm chip

(SV560) BGA/IC/GPU  Reballing Station for all kinds of motherboard

Specifications: (SV560)
PCB dimension	W20*20~500*550mm
PCB thickness	0.5~2.5mm
Working table adjustment	+/-120mmforward/backward,+/-80mm left/right
Temperature control	K-type thermocouple, close cycle controlled
PCB locating	Outer
Upper heater	Hot gas 1200w
Lower heater	Hot gas 800w
Bottom preheat	Far infrared 3600w
Power supply	Single-phase 220,50/60Hz. 5.5kw
BGA dimension	1*1~70*70mm
Min pitch of BGA ball	0.15mm
Placement precision	0.01mm
Max BGA weight	300g
Machine dimension	L850*W750*H630mm
Machine weight	Approx. 80kg

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