BGA Repair System (PS400)
Specification
PCB dimension: W20×20~W350×350mm
PCB thinkness: 0~4mm BGA dimension: 1mm×1mm~70mm×70mm Working table adjustment: ±10MM forward/backward,±10MM left/rightLower hot-air heater: 800W
Upper hot-air heater: 800W
Bottom preheatfar infrared: 2700W
Temperatur control: K-type thermocoupleclose cycle controlledPCB locating way: Outer or Jig Power supply: single-phase 220V,50/60Hz,4.5KWMachine dimension: L600×W600×H750mm
Weight: Appox. 85Kgs
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BGA Repair System
* The streamline design is gorgeous and room-saving.* Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and
mounting function.* Upper/lower hot-air heating,bottom infrared,three independent heating areas, temperature
and time can be displayed digitally on the touch screen.* Powerful cross flow fans cool the bottom heating zone rapidly and constantly.* Color optical system with functions of spilt vision, zoom-in and micro-adjust, equipped with
aberration detection device; with auto focus and software operation function, 22X optical
zoom.* Embeded industrial computer can ananlyze the two proctically-tested profiles, and compare them with the history saved profiles;profile saving no limit for the industrial computer
* Color LCD monitor, touch screen interface;* Built-in vacuum pump;60 rotating in φ angle mounting nozzle is micro-adjustable.* 8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is unlimited in the industrial computer;
* Suction nozzle can identify material and mounting height automatically, and can control the
air pressure within a small range.* Equipped with different hot air nozzles, easy to replace and able to locate in any angle.* Big size splint, equipped with deformation-proof supporting device,suitable for the accurate
rework of all kinds of PCB.
* Can handle 775 socket, 478 socket,PS2/3,PSP, etc
BGA Repair System (PS400)