... .Buid-in pump,even hot air distribution 2.Remove SOIC,QFP,PLCC,BGA,SMC chips easily SBK858 Most Cost Effective/Lowest ... product Hot Air Rework Station Product Description Suitable for SOIC, QFP, PLCC, BGA, SMC and temperature-sensitive components. Work great for ... etc.Features ♦ Hot air temperature and volume adjustable,ideal for QFP,SOP,PLLCC and SOJ chips removing. ♦ Built-in sensor ensures ...